Plasma Technology Overview
| Article Index |
|---|
| Plasma Technology Overview |
| What is a Plasma? |
| Plasma Effects |
| Plasma Cleaning |
| Plasma Surface Activation |
| Plasma Coatings |
| Plasma Etching |
| All Pages |
Page 7 of 7
Plasma Etching
Plasma etching is used to 'roughen' a surface, on the microscopic scale. The surface of the component is etched with a reactive process gas. Material is precisely sputtered off, converted to the gas phase and sucked away via the vacuum system. The surface area is greatly increased, making the material easily wettable. Etching is used before printing, gluing and painting and is particularly useful for processing of e.g. POM and PTFE, which cannot otherwise be printed on or bonded.
plasma etching effects
Untreated Surface Plasma Etched Surface
Plasma etching is suitable for e.g.:
- POM, PTFE, FEP, PFA
- PTFE compounds
- structuring silicon
- photoresist ashing